R2R and S2S Laser Scribing, Patterning and Cutting
OET provides the process technology platform for the optimization of short pulsed laser processing in production of Organic & Printed Electronics with minimal loss in active area and high quality in device performance. Short pulsed Laser scribing is considered ideal for selective thin film material removal on rigid and flexible substrates due to low temperature removal mechanism (Cold Ablation) via Ultra-Short Pulsed Lasers.
OET's in-line R2R short pulsed laser unique processes and tools are ideal for:
A wide variety of materials can be processed by short pulsed laser scribing:
OET achieves complete removal of multiple layers without any residue by optimizing the key parameters in R2R manufacturing of OPV devices. Also, OET manufactures the required layer and device structure with laser cut (P1, P2, P3) processes that involve multiple steps with different optimized parameters.
“Laser Patterning of smart Nanomaterials for Reel-to- Reel production of Organic Photovoltaic (OPV) Devices”, JLMN-Journal of Laser Micro/Nanoengineering Vol. 10, No. 2, 2015, DOI: 10.1117/12.2077488
“The effect of laser pulse duration and beam shape on the selective removal of novel thin film layers for flexible electronic devices”, Proc SPIE 9657 · July 2015, DOI: 10.1117/12.2175501
For more details about scribing – patterning possibilities pricing, you can contact us.